2332538-1

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2332538-1 is a high-density edgeboard connector designed for vertical sliver mounting configurations. It features 148 positions arranged in a dual-edge interface with a contact pitch of 0.024 inches (0.60mm). The connector utilizes gold-plated contacts to ensure reliable signal transmission and includes a black housing constructed from durable thermoplastic materials. This component supports surface-mount technology, allowing for secure attachment to printed circuit boards while maintaining precise alignment for mating with corresponding edge cards.

Edgeboard Connectors Feature Summary

• Vertical sliver mounting design for space-constrained applications
• Dual-edge gold-plated contact interface for enhanced conductivity
• High-density 148-position configuration with fine 0.024-inch pitch

Edgeboard Connectors Applications

• Industrial control systems requiring high I/O density
• Telecommunications infrastructure equipment
• Automotive electronic modules
• Medical instrumentation devices

Edgeboard Connectors Procurement Notes

Verify the specific datasheet version and compliance documentation before procurement. Confirm that the vertical sliver form factor matches the mechanical constraints of the target PCB layout. Ensure compatibility with mating edge card specifications regarding contact resistance and plating thickness. Review environmental certifications such as RoHS status to meet regulatory requirements for the intended market.

Edgeboard Connectors Selection Notes

Select this component when a high pin count is required within a limited vertical footprint. The dual-edge gold plating makes it suitable for applications demanding low contact resistance and corrosion resistance. Consider the 0.024-inch pitch for dense signal routing needs. Evaluate thermal management requirements as the compact design may influence heat dissipation compared to larger pitch alternatives.

Edgeboard Connectors Part Context

This connector belongs to the broader family of TE Connectivity AMP edgeboard solutions, which are engineered for robust performance in demanding environments. The 2332538-1 specifically addresses the need for high-density interconnects in modern electronics where board space is at a premium. Its design aligns with industry standards for vertical insertion, providing stability and reliability for critical signal paths in complex electronic assemblies.

Edgeboard Connectors Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Consult TE Connectivity technical support for direct replacements or obsolescence management strategies if this specific model becomes unavailable.