2333799-1

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2333799-1 is a dual female edgeboard connector designed for high-density signal transmission. It features 168 positions with a 0.024-inch (0.60mm) pitch, arranged in a 28-14-28-14 configuration across two rows. The contacts are gold-plated copper alloy, providing reliable conductivity and corrosion resistance. This surface-mount receptacle assembly includes board guide slots, pick-and-place compatibility, and solder retention features to ensure secure mounting on printed circuit boards.

Edgeboard Connectors Feature Summary

• Dual female contact configuration for edge card insertion
• Integrated board guide slots for precise alignment during assembly
• Pick-and-place compatible design for automated manufacturing processes
• Solder retention structure ensures stable connection to the substrate

Edgeboard Connectors Applications

• High-density electronic interconnect systems
• Industrial control module backplanes
• Telecommunications equipment signal routing
• Automotive electronics data processing units

Edgeboard Connectors Procurement Notes

Verify the specific suffix and plating thickness against the official datasheet before ordering. Confirm that the supplier provides the original manufacturer's documentation to ensure authenticity. Check for any recent product change notices regarding material or process updates. Ensure the procurement channel is authorized to guarantee full warranty coverage and traceability of the components.

Edgeboard Connectors Selection Notes

Select this component when a high-pin-count, low-pitch edge connector is required for surface mount applications. The 0.024-inch pitch allows for dense packing within limited board areas. Consider the gold plating for environments requiring long-term reliability without oxidation. Ensure the mating edge card thickness aligns with the connector's mechanical specifications for proper engagement.

Edgeboard Connectors Part Context

This part belongs to the Sliver 2.0 series, which is engineered for compact, high-performance interconnect solutions. The series utilizes advanced materials like liquid crystal polymer for superior thermal stability. It supports modern manufacturing techniques through its surface-mount design and automated assembly features, fitting into contemporary high-density electronics architectures.

Edgeboard Connectors Replacement Considerations

Direct substitutes may include other TE Connectivity parts within the same Sliver 2.0 family with identical pin counts and pitch. Verify mechanical dimensions and electrical ratings before swapping. Cross-referencing with generic equivalents requires careful validation of contact geometry and insulation material properties to maintain system integrity.