2336568-3

Edgeboard Connectors Overview

The 2336568-3 is a dual-edge card edge connector receptacle assembly manufactured by TE Connectivity AMP Connectors. It features 168 positions with a 0.60 mm (0.024 inch) pitch and utilizes gold-plated contacts for reliable signal transmission. Designed for surface mount installation, this component supports right-angle mounting to facilitate compact circuit board layouts. The housing is constructed from black liquid crystal polymer (LCP), providing high thermal stability and mechanical strength. It is rated for a maximum operating temperature of +85°C and a minimum of -55°C, ensuring performance across a wide industrial temperature range.

Edgeboard Connectors Feature Summary

• Dual-edge configuration supporting non-specified card types for versatile interface applications
• Gold-plated copper alloy contacts ensure low contact resistance and corrosion resistance
• Right-angle surface mount design optimizes vertical space on printed circuit boards
• Liquid crystal polymer housing offers high heat resistance and dimensional stability

Edgeboard Connectors Applications

• High-density data communication equipment interfaces
• Industrial control system backplanes and I/O modules
• Telecommunications network infrastructure cards
• Automotive electronic control unit interconnections

Edgeboard Connectors Procurement Notes

Verify the specific revision level against the manufacturer's latest documentation before procurement, as component specifications may undergo updates. Confirm that the receiving facility has appropriate surface mount handling capabilities suitable for fine-pitch components. Ensure storage conditions maintain humidity sensitivity levels to prevent soldering defects during assembly. Cross-reference the pinout and mating card thickness requirements with the target application design to guarantee mechanical compatibility.

Edgeboard Connectors Selection Notes

Select this component when a high-pin-count, dual-edge connection is required in a constrained vertical space. The 0.60 mm pitch allows for significant I/O density compared to standard 1.27 mm or 2.54 mm connectors. Consider the right-angle orientation if cable management or adjacent component clearance necessitates a perpendicular board interface. Evaluate the LCP material properties against the peak reflow temperatures of the assembly process to ensure housing integrity.

Edgeboard Connectors Part Context

This part belongs to the Sliver 2.0 series of card edge connectors, which are engineered for high-reliability applications requiring robust electrical performance. The series is characterized by its fine pitch and durable construction, suitable for demanding environments. As a receptacle assembly, it mates with corresponding edge-plated circuit cards, forming a secure electrical pathway within complex electronic systems.

Edgeboard Connectors Replacement Considerations

Direct substitutes must match the 168 position count, 0.60 mm pitch, dual-edge geometry, and right-angle SMT footprint. Verify that alternative components offer equivalent gold plating thickness and LCP housing ratings. Ensure the replacement maintains the same current rating and mechanical locking features to preserve system reliability.