2345246-1

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2345246-1 is a vertical high-density card edge power connector designed for through-hole mounting. It features a dual-side contact configuration with a total of 50 positions, comprising 20 power contacts and 20 signal contacts per side, arranged in a 2x10P-2x10S layout. The connector utilizes a 2.54 mm (0.1 inch) centerline pitch to ensure reliable board-to-board interconnection. Constructed with copper alloy contacts finished with gold plating, it provides durable electrical performance. The housing supports secure insertion into corresponding card edge connectors, facilitating efficient power and signal transmission in compact electronic assemblies.

Edgeboard Connectors Feature Summary

• Dual-side contact design enabling simultaneous power and signal routing across the card edge interface.
• High-density arrangement with 2.54 mm centerline pitch to maximize connection density within limited board space.
• Through-hole termination method ensures robust mechanical stability and reliable solder joint integrity.

Edgeboard Connectors Applications

• Board-to-board interconnects requiring dedicated power and signal paths
• High-density electronic modules utilizing card edge form factors
• Industrial equipment interfaces demanding reliable vertical mounting solutions

Edgeboard Connectors Procurement Notes

Verify the specific pinout configuration and contact arrangement against the official datasheet before integration. Confirm that the receiving card edge connector matches the 2.54 mm pitch and dual-side contact requirements. Ensure manufacturing processes accommodate through-hole soldering techniques suitable for the specified contact materials. Cross-reference the latest product change notices to confirm component availability and compliance status.

Edgeboard Connectors Selection Notes

Select this component when a vertical, through-hole card edge solution is required for mixed power and signal applications. The 2.54 mm pitch offers a balance between density and manufacturability. Consider the dual-side contact layout if separate power and signal domains are needed on opposing edges. Evaluate thermal management requirements as the through-hole design impacts heat dissipation during soldering and operation.

Edgeboard Connectors Part Context

This connector belongs to the TE Connectivity AMP High-Density Card Edge series, engineered for demanding industrial and commercial environments. The AMP line emphasizes reliability in harsh conditions, leveraging decades of expertise in ruggedized interconnects. This specific model continues the tradition of providing robust, space-efficient solutions for complex electronic systems requiring stable board-to-board connections.

Edgeboard Connectors Replacement Considerations

Consult official TE Connectivity documentation for verified substitute part numbers. Ensure any replacement maintains identical 2.54 mm pitch, dual-side contact configuration, and through-hole mounting characteristics. Verify compatibility with existing PCB footprints and mating card edge connectors before implementation.