23S08-1HPGG

23S08-1HPGG

  • Description:IC CLOCK MULTIPLIER 16TSSOP
  • Series:-

SKU:eba03497f8b2 Category: Brand:

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Product Detailed Parameters

  • Description:IC CLOCK MULTIPLIER 16TSSOP
  • Series:-
  • Package:Tube
  • Mfr:Renesas Electronics Corporation
  • PLL:Yes with Bypass
  • Input:LVTTL
  • Output:CMOS, LVTTL
  • Number of Circuits:1
  • Ratio - Input:Output:1:08
  • Differential - Input:Output:No/No
  • Frequency - Max:133.3MHz
  • Divider/Multiplier:No/No
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package:16-TSSOP
  • Type:Clock Multiplier, Zero Delay Buffer

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23S08-1HPGG

Overview

The Renesas Electronics 23S08-1HPGG is a 3.3V zero-delay clock multiplier designed for high-speed clock distribution applications. It accepts spread spectrum inputs and operates within a frequency range of 10 MHz to 133 MHz. The device features one LVCMOS input and eight LVCMOS outputs, providing a 1:8 multiplication ratio with a multiply/divide value of 1. Packaged in a 16-pin TSSOP (PGG16) with a 0.65 mm pitch, it ensures low jitter performance with a maximum cycle-to-cycle jitter of 200 ps and output skew of 200 ps. The component supports commercial operating temperatures from 0°C to +70°C.

Feature Summary

  • Zero-delay PLL architecture synchronizes output phase to the input clock reference.
  • Accepts spread spectrum input signals for EMI reduction.
  • Eight LVCMOS outputs driven by a single LVCMOS input.
  • Low jitter specification with max 200 ps cycle-to-cycle jitter and 200 ps output skew.

Applications

  • High-speed clock distribution systems requiring zero delay alignment.
  • Spread spectrum clocking implementations for EMI mitigation.
  • Digital logic circuits operating at frequencies up to 133 MHz.

Part Context

This component belongs to the 23S08 family of zero-delay buffers manufactured by Renesas Electronics. It is functionally similar to other variants such as the 23S08-2HDCG but differs in package type (TSSOP vs SOIC) and specific electrical characteristics like drive strength or pinout configuration. The suffix 'HPGG' denotes the specific lead-free TSSOP packaging option.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Engineers should verify compatibility with alternative devices based on package dimensions, voltage levels, and timing specifications.

23S08-1HPGG23S08-1HPGG

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