23S08-2DCGI8

Overview

The Renesas Electronics Corporation 23S08-2DCGI8 is a 3.3V zero-delay clock multiplier designed for high-performance digital systems. It accepts an LVCMOS input frequency ranging from 10 MHz to 133 MHz and provides eight LVCMOS outputs within the same frequency range. The device features a maximum center-to-center jitter of 200 ps and supports spread spectrum input compatibility. Packaged in a 16-pin SOIC, it operates within a commercial temperature range of 0°C to +70°C.

Feature Summary

• Zero-delay architecture with 1x or 2x multiply/divide values
• Eight LVCMOS output drivers at 3.3V
• Spread spectrum input compatibility
• Maximum center-to-center jitter of 200 ps

Applications

• High-speed data acquisition systems
• Telecommunications infrastructure equipment
• Industrial control networks requiring precise timing synchronization

Procurement Notes

Verify component authenticity through authorized channels due to potential availability constraints. Confirm moisture sensitivity level (MSL 3) handling requirements during storage and assembly. Ensure supply chain stability as this specific variant may have limited distribution compared to standard family members.

Selection Notes

Select this model when a fixed 1x or 2x multiplication ratio is required without programmable configuration. The SOIC-16 package suits applications where board space allows for larger footprints but requires surface-mount convenience. Verify that the 200 ps jitter specification meets system timing margins.

Part Context

This component belongs to the IDT 23S08 series of clock multipliers, originally developed by Integrated Device Technology before its acquisition by Renesas. The part number suffix 'I8' typically denotes industrial temperature grading and specific packaging configurations within the broader 23S08 product line.

Replacement Considerations

Direct pin-compatible substitutes include the IDT23S08-2DCG and IDT23S08-2DCI variants. Cross-reference datasheets to confirm identical electrical characteristics and package dimensions before substitution.