23S09E-1HDCGI

Overview

The Renesas 23S09E-1HDCGI is a Zero Delay Buffer IC designed for high-speed clock distribution. It features an internal Phase-Locked Loop (PLL) that aligns the phase between the incoming reference clock and output clocks, achieving zero delay. The device accepts one LVTTL input and provides nine CMOS/LVTTL outputs with a 1:9 ratio. It operates within a frequency range up to 200MHz and supports a supply voltage of 3V to 3.6V. Packaged in a 16-SOIC format, it is characterized for industrial temperatures ranging from -40°C to 85°C.

Feature Summary

• Zero Delay Buffer architecture using on-chip PLL for phase alignment
• 1:9 Input-to-Output ratio with single reference input
• Operational frequency up to 200MHz
• Low power consumption with tri-stated outputs in power-down mode

Applications

• High-speed clock distribution systems
• System synchronization requiring low skew
• Digital signal processing equipment

Procurement Notes

This component is officially obsolete and no longer manufactured by Renesas Electronics Corporation. Current stock levels are reported as zero. Verification of availability should focus on the recommended replacement part number rather than this specific model.

Selection Notes

Designers must account for the discontinuation status when selecting this part. The datasheet indicates a manufacturer-recommended substitute, the 23S09-1HPGGI8. Selection should prioritize verifying pin compatibility and electrical specifications against the replacement to ensure system integrity.

Part Context

The 23S09 series belongs to Renesas' family of high-speed PLL clock buffers. This specific variant utilizes the 'E' suffix designation and is housed in a standard 16-pin SOIC package. It serves as a specialized solution for distributing clock signals with minimal jitter and skew in complex digital architectures.

Replacement Considerations

Renesas recommends the 23S09-1HPGGI8 as the direct replacement for the discontinued 23S09E-1HDCGI. Engineers should validate the functional equivalence and physical footprint compatibility before transitioning designs.