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The Johanson Technology Inc. 2450FB15C0050001E is an integrated RF balun filter designed for the 2.4GHz to 2.5GHz frequency range, specifically targeting Bluetooth and WLAN applications. It operates with a 50 Ohm unbalanced to 50 Ohm balanced impedance configuration. The component is housed in a compact 0805 (2012 metric) surface-mount package. Key electrical specifications include a maximum insertion loss of 3.5dB and a minimum return loss of 9.5dB. This device integrates filtering capabilities alongside the balun function to enhance signal integrity in wireless modules.
Verify the specific suffix 'C' against the manufacturer's latest datasheet to confirm impedance matching and tolerance variations compared to other variants in the 2450FB series. Ensure the ordering code matches the required tape-and-reel quantity specifications. Cross-reference the RoHS compliance status and moisture sensitivity level requirements with your assembly process standards before finalizing procurement orders.
Select this component when a combined balun and filter solution is required to reduce bill of materials count and PCB area. The 0805 package size offers a balance between performance and layout flexibility. Consider the 3.5dB insertion loss specification relative to system link budget requirements. Evaluate thermal management needs as the component handles RF power levels typical for short-range wireless protocols without active cooling.
This part belongs to Johanson Technology's 2450 series of integrated passive components, which are engineered for 2.4GHz ISM band applications. The series includes various configurations differing in impedance ratios, package sizes, and filtering characteristics. The FB designation typically indicates a balun-filter combination, distinguishing it from pure balun or pure filter variants within the same product family line.
Public confirmed substitute part numbers are not available in the provided documentation. Direct replacement requires verifying identical impedance ratios, frequency ranges, and package dimensions. Alternative solutions may involve discrete component networks, which would increase board space and require re-verification of S-parameter performance.