2508056017Y2

Overview

The Fair-Rite 2508056017Y2 is a multi-layer chip ferrite bead designed for surface-mount applications. It provides an impedance of 600 Ohms at 100 MHz and supports a maximum DC current of 2000 mA. The component utilizes a 0805 (2012 metric) package with dimensions of 2.0 mm length, 1.25 mm width, and 0.9 mm height. It operates within a temperature range of -55°C to +125°C.

Feature Summary

• Multi-layer construction for effective conducted EMI signal suppression
• High current handling capability suitable for power line filtering
• Compact surface-mount footprint enabling dense circuit board packaging

Applications

• Suppression of high-frequency noise in portable electronic devices
• EMI filtering in computer and laptop power circuits
• Signal integrity protection in cellular communication hardware

Procurement Notes

Verify the specific impedance tolerance and DC resistance values against the official Fair-Rite datasheet prior to integration. Confirm that the 0805 package dimensions align with the PCB land pattern requirements. Ensure the selected variant meets all relevant RoHS compliance standards for the target market.

Selection Notes

Select this component when a 600 Ohm impedance at 100 MHz is required for noise attenuation. The 2000 mA current rating makes it appropriate for power supply lines rather than low-current signal traces. Consider the 0805 package size as a balance between thermal performance and space constraints compared to smaller footprints.

Part Context

This part belongs to the Fair-Rite Series 25 multilayer chip beads. This series offers various impedance and current ratings within standard EIA package sizes. The components are engineered to suppress electromagnetic interference in compact electronic assemblies without significantly increasing the physical profile of the circuit board.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Engineers must evaluate alternative components based on matching impedance curves, current ratings, and package dimensions.