2512061027Y1

Overview

The Fair-Rite 2512061027Y1 is a multilayer ferrite chip bead designed for conducted EMI suppression in surface-mount applications. It features a 1206 (3216 metric) package with dimensions of 3.2 mm length, 1.6 mm width, and 1.1 mm height. The component provides an impedance of 1 kOhms at a test frequency of 100 MHz. It supports a maximum DC current of 1 A and has a maximum DC resistance of 300 mOhms. The device operates within a temperature range of -55°C to +125°C.

Feature Summary

• Multilayer construction for effective conducted EMI signal suppression
• Surface-mount design compatible with standard SMD/SMT assembly processes
• High impedance performance at 100 MHz for noise filtering

Applications

• General EMI suppression in electronic circuits
• Signal line filtering in surface-mount assemblies

Procurement Notes

Verify the specific suffix Y1 against official Fair-Rite documentation to confirm exact material composition and tolerance specifications. Confirm RoHS compliance status directly with the manufacturer or authorized distributor, as regulatory details may vary by production batch. Ensure the ordering quantity aligns with available packaging formats such as cut tape or reel, and validate lead times through official supply channels prior to procurement planning.

Selection Notes

Select this component when high impedance at 100 MHz is required for EMI suppression in space-constrained designs. The 1206 footprint offers a balance between current handling capability and board area efficiency. Consider the 1 A current rating and 300 mOhm DC resistance for power loss calculations. Verify thermal stability requirements against the -55°C to +125°C operating range for the intended application environment.

Part Context

This part belongs to the Fair-Rite Series 25 family of multilayer chip beads. This series provides cost-effective solutions for suppressing conducted electromagnetic interference. The components utilize multilayer ferrite technology to achieve high impedance characteristics in a compact surface-mount package suitable for modern electronics manufacturing.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Consult Fair-Rite technical resources for potential cross-references based on impedance, current rating, and package dimensions.