2512065008Y6

Overview

The Fair-Rite Products Corp. part number 2512065008Y6 is a multilayer ferrite chip bead designed for surface-mount technology applications. It operates within the 1206 (3216 metric) package dimensions, measuring 3.2 mm in length, 1.6 mm in width, and 1.1 mm in height. The component provides an impedance of 1.07 kOhms at a test frequency of 100 MHz. It supports a maximum DC current of 200 mA and features a maximum DC resistance of 600 mOhms. The device functions reliably across a temperature range from -55°C to +125°C.

Feature Summary

• Multilayer construction for effective conducted EMI signal suppression
• Surface-mount design compatible with automated assembly processes
• Shielded configuration to minimize electromagnetic interference

Applications

• Suppression of high-frequency noise on data lines
• EMI filtering in portable electronic devices
• Signal integrity enhancement in compact circuit boards

Procurement Notes

Verify the specific impedance tolerance and DC resistance values against the official datasheet before integration. Confirm that the 1206 package footprint matches the target PCB layout. Ensure the operating temperature range meets the environmental requirements of the final application. Check for RoHS compliance status if required by regulatory standards.

Selection Notes

Select this component when space constraints require a 1206 footprint with high impedance characteristics. Consider the 200 mA current rating to ensure it does not saturate under normal operating conditions. Evaluate the low DC resistance to minimize voltage drop in power-sensitive circuits. Compare performance against other series members if different impedance profiles are needed.

Part Context

This component belongs to the Fair-Rite Series 25 family of multilayer chip beads. These parts are engineered to provide cost-effective solutions for suppressing conducted electromagnetic interference. The series offers various impedance options within standardized surface-mount packages to support diverse electronic design requirements.

Replacement Considerations

Consult the manufacturer's substitution guide for verified alternatives. Ensure any replacement maintains identical package dimensions and electrical parameters. Verify compatibility with existing assembly processes and thermal management strategies.