2518066006Y3

2518066006Y3

$0.03
  • Description:FERRITE BEAD MULT LAYER CHIP
  • Series:*
  • Mfr:Fair-Rite Products Corp.
  • Package:Bulk

SKU:5ec09fe9b277 Category: Brand:

  
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Product Detailed Parameters

  • Description:FERRITE BEAD MULT LAYER CHIP
  • Series:*
  • Mfr:Fair-Rite Products Corp.
  • Package:Bulk
  • Filter Type:-
  • Number of Lines:-
  • Impedance @ Frequency:-
  • Current Rating (Max):-
  • DC Resistance (DCR) (Max):-
  • Ratings:-
  • Operating Temperature:-
  • Package / Case:-
  • Mounting Type:-
  • Height (Max):-
  • Size / Dimension:-
  • Features:-

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2518066006Y3

Overview

The Fair-Rite 2518066006Y3 is a multi-layer ferrite chip bead designed for surface mount applications. It belongs to the Series 25 product line and utilizes SMD/SMT termination types within an 1806 (4516 metric) package. The component exhibits an impedance of 6 ohms at 100 MHz with a tolerance of 25 percent. It supports a maximum DC current of 3 A and maintains a maximum DC resistance of 40 mOhms. The device operates reliably between -55 C and +125 C, with physical dimensions of 4.5 mm in length.

Feature Summary

  • Multi-layer construction enables effective suppression of conducted electromagnetic interference signals
  • Surface mount design facilitates automated placement and dense circuit board packaging
  • RoHS compliant manufacturing ensures adherence to environmental standards

Applications

  • Electromagnetic interference suppression in electronic circuits
  • Signal integrity management in compact consumer devices
  • High-density PCB layout implementations requiring small form factors

Procurement Notes

Verify component authenticity through official Fair-Rite channels or authorized distributors. Confirm RoHS compliance status and specific lot traceability upon receipt. Ensure storage conditions align with manufacturer guidelines to preserve material integrity. Cross-reference datasheet specifications against procurement orders to validate impedance and current ratings match design requirements precisely.

Selection Notes

Select this component when space constraints necessitate an 1806 footprint with low impedance characteristics. Evaluate thermal performance limits relative to expected operating environments up to 125 C. Consider the 3 A current rating for power distribution lines requiring minimal signal attenuation. Verify compatibility with standard reflow soldering profiles for SMD assembly processes.

Part Context

This part is part of the Fair-Rite Series 25 family of multilayer chip beads. These components are engineered to provide cost-effective solutions for EMI suppression across various electronic applications. The series emphasizes small package sizes suitable for modern automated manufacturing techniques while maintaining robust filtering capabilities.

Replacement Considerations

Consult Fair-Rite documentation for direct equivalents within the Series 25 lineup. Verify package dimensions and electrical parameters before substituting with other manufacturers' offerings. Ensure any alternative component meets the same impedance and current handling specifications.

2518066006Y32518066006Y3
$0.03
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