SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Fair-Rite Products Corp. part number 2518121216Y3 is a multi-layer chip ferrite bead designed for surface-mount technology applications. It features an 1812 package dimension and provides an impedance of 120 Ohms at a test frequency of 100 MHz with a tolerance of 25%. The component supports a maximum DC current rating of 3 Amperes and exhibits a low maximum DC resistance of 0.04 Ohms. It operates within a temperature range of -55°C to +125°C and is supplied in bulk packaging.
Verify the specific suffix Y3 against the manufacturer's latest datasheet to confirm material composition and impedance characteristics, as suffixes often denote critical variations. Ensure the selected distributor sources directly from Fair-Rite or authorized channels to guarantee authenticity. Confirm RoHS compliance status matches project requirements before finalizing procurement orders.
Select this component when circuit design demands a surface-mount ferrite bead capable of handling up to 3 Amperes of direct current without saturation. The 1812 footprint offers a balance between current capacity and board space efficiency. Verify that the 120 Ohm impedance profile at 100 MHz aligns with the target noise frequencies and that the 0.04 Ohm DC resistance meets voltage drop constraints.
This component belongs to the Fair-Rite multi-layer chip ferrite bead series, which utilizes proprietary ceramic formulations to provide effective broadband noise suppression. These beads are engineered for automated assembly processes and are commonly used in consumer electronics, telecommunications equipment, and industrial control systems where reliable EMI/RFI mitigation is required in space-constrained environments.
Direct substitutes must match the 1812 package size, 120 Ohm impedance at 100 MHz, and 3A current rating. Evaluate alternative manufacturers offering multi-layer chip beads with comparable DC resistance and temperature stability. Ensure pinout compatibility and mounting orientation remain consistent with existing PCB layouts.