25EMPPC603E2BB200K

Overview

The IBM 25EMPPC603E2BB200K is a microprocessor featuring the PowerPC EM603e core architecture. It operates at a clock speed of 200MHz and utilizes a 32-bit bus width. The component is housed in a 278-pin FCPBGA package with dimensions of 21x21 mm. It supports an operating junction temperature range from 0°C to 105°C. This single-core processor is designed for embedded applications requiring high performance and power efficiency.

Feature Summary

• Implements the PowerPC EM603e core architecture for embedded processing tasks
• Delivers high-performance execution at a 200MHz clock frequency
• Features a compact 278-pin FCPBGA package suitable for space-constrained designs

Applications

• Server systems
• Embedded control units
• Industrial automation equipment

Procurement Notes

Verify the specific suffix '2BB200K' against official IBM documentation to confirm the exact speed grade and temperature rating. Ensure compatibility with existing board layouts regarding the 21x21mm FCPBGA footprint. Confirm that the 0°C to 105°C operating range meets your environmental requirements before finalizing procurement.

Selection Notes

Select this component when a dedicated PowerPC EM603e core is required for embedded logic. Consider the 200MHz performance ceiling and 32-bit data path for system throughput needs. Evaluate the thermal management capabilities required for the specified industrial temperature range within the target enclosure design.

Part Context

This part belongs to the IBM PowerPC EM series, which targets embedded market segments. The EM603e variant provides a balance of computational power and energy efficiency. It serves as a foundational processor for specialized hardware solutions where standard consumer CPUs are unsuitable due to environmental or architectural constraints.

Replacement Considerations

No public confirmed substitute part numbers are available for this specific IBM configuration.