25LC256-E/P

Overview

The Microchip Technology 25LC256-E/P is a 256 Kbit (32,768 x 8-bit) Serial Electrically Erasable PROM accessed via an SPI-compatible serial bus. It operates within a supply voltage range of 2.5V to 5.5V and supports a maximum clock frequency of 10 MHz. The device features a 64-byte page write capability with self-timed erase and write cycles completing in a maximum of 5 ms. It is housed in an 8-lead PDIP package and supports extended industrial temperature ranges from -40°C to +125°C.

Feature Summary

• Supports block-level write protection allowing configuration to protect none, one-quarter, one-half, or the entire memory array.
• Includes built-in power-on/off data protection circuitry combined with a write enable latch for secure operations.
• Features a hold input pin that allows suspension of serial communication without resetting the sequence.

Applications

• Data acquisition systems requiring non-volatile storage
• Personal communications devices
• Microcontroller-based embedded applications

Procurement Notes

Verify the specific ordering suffix 'E' confirms the extended temperature rating (-40°C to +125°C) and the 'P' suffix indicates the 8-lead PDIP package. Confirm RoHS compliance status and automotive AEC-Q100 qualification requirements against the final datasheet revision before procurement.

Selection Notes

Select this component when an SPI interface is required for non-volatile data retention. Ensure the system voltage remains above 2.5V as lower voltages are not supported by this specific part variant. Consider the 64-byte page size limitation for write operations to optimize firmware efficiency.

Part Context

This device belongs to the 25AA256/25LC256 family of 256K SPI Bus Serial EEPROMs. While functionally similar to the 25AA256, the 25LC256 variant is distinguished by its minimum operating voltage requirement of 2.5V compared to the 1.8V support found in the AA series.

Replacement Considerations

The 25LC256-I/P serves as the industrial temperature rated alternative. Other package variants such as 25LC256-SN (SOIC), 25LC256-MF (DFN), and 25LC256-ST (TSSOP) offer equivalent electrical performance with different physical footprints.