25PPC750CXEFP2012T

Overview

The IBM 25PPC750CXEFP2012T is a PowerPC 750CXe RISC microprocessor featuring a 32-bit architecture and a 400MHz clock speed. It utilizes a 256-pin Plastic Ball Grid Array (PBGA) package measuring 27x27 mm. The device supports boundary scan, integrated cache, and floating-point operations. It operates within a temperature range of -40°C to 105°C TJ.

Feature Summary

• Implements the PowerPC 750CXe core architecture for embedded processing
• Supports boundary scan testing for manufacturing verification
• Includes integrated cache memory structures
• Provides floating-point arithmetic capabilities

Applications

• Telecommunications infrastructure equipment
• Industrial control systems
• Embedded computing modules

Procurement Notes

Verify the specific revision level against the official datasheet before procurement. Confirm that the PBGA-256 package dimensions match the design constraints. Ensure thermal management solutions accommodate the specified junction temperature range. Validate compliance requirements for the target deployment region.

Selection Notes

Select this component when a 400MHz PowerPC 750CXe core is required in a 256-pin BGA form factor. Consider the 27x27 mm footprint for PCB layout planning. Evaluate the operating temperature range against environmental conditions. Compare performance metrics with other variants in the PowerPC 750 family if higher speeds are needed.

Part Context

This part belongs to the IBM PowerPC 750 series, designed for high-performance embedded applications. The 750CXe variant offers enhanced efficiency compared to earlier models. It is widely used in aerospace, defense, and industrial sectors requiring reliable RISC processing.

Replacement Considerations

Consult official documentation for qualified substitutes. Cross-reference pinouts and electrical characteristics carefully. Verify compatibility with existing software environments and hardware interfaces before substitution.