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The IBM 25PPC750CXEFP5513 is a PowerPC 750CX RISC microprocessor featuring a 32-bit architecture and a single core. It operates at a maximum clock frequency of 533 MHz and utilizes CMOS technology. The component is housed in a 256-pin Plastic Ball Grid Array (PBGA) package with dimensions of 27x27 mm. Key technical specifications include an integrated cache, support for boundary scan testing, and low power mode capabilities. The external data bus width is 64 bits, while the address bus width is 32 bits. The device supports floating-point operations and is compliant with RoHS standards.
Verify the specific suffix EFP5513 against official IBM documentation to confirm pinout compatibility and thermal characteristics. Ensure the procurement source provides valid traceability for this active component. Confirm RoHS compliance status matches project requirements. Validate that the 256-pin PBGA package dimensions align with the target PCB footprint design constraints before finalizing orders.
Select this component when a 32-bit embedded solution with integrated cache is required. The 533 MHz speed suits moderate-performance applications. Consider the 256-pin BGA package size for board space limitations. Verify that the external 64-bit data bus interface meets system memory controller requirements. Ensure thermal management strategies accommodate the plastic BGA package type.
This part belongs to the IBM PowerPC 750 family of embedded processors. The 750 series was widely adopted in consumer electronics, networking gear, and industrial controls during the late 1990s and early 2000s. The CX variant represents a specific iteration within this lineage, optimized for cost-effective embedded applications while maintaining high reliability and standard RISC architecture features.
Publicly confirmed substitute part numbers are not available in the provided documentation. Cross-referencing with other PowerPC 750 variants requires careful verification of clock speeds, package types, and electrical specifications.