266298

Overview

The Boyd Laconia LLC part number 266298 is a thermal management component, specifically identified as a heat sink designed for TO-220 package applications. It features a clip-on mounting style suitable for vertical board-level installation. The unit is constructed from aluminum material with a black anodized surface finish to enhance durability and thermal performance. This component serves as a passive cooling solution for electronic devices requiring efficient heat dissipation without active airflow mechanisms.

Feature Summary

• Clip-on mounting design for secure attachment to TO-220 packages
• Vertical board-level orientation for standard PCB integration
• Aluminum construction with black anodized surface treatment

Applications

• Cooling power transistors in TO-220 packages
• Thermal management for voltage regulators
• Heat dissipation for general-purpose power electronics

Procurement Notes

Verify the specific thermal resistance values and physical dimensions against the official Boyd Laconia datasheet before integration. Confirm that the TO-220 clip-on mechanism matches the target component's lead spacing and body width. Ensure the black anodized finish meets environmental requirements for the intended operating conditions. Cross-reference the manufacturer part number 266298 with the base series 590302 to confirm exact specifications.

Selection Notes

Select this component when a passive, low-profile cooling solution is required for TO-220 packaged devices. The clip-on design simplifies assembly compared to bolted alternatives. Consider the natural convection thermal performance if forced air is not available in the system. Verify that the aluminum material and anodized coating are compatible with the ambient temperature range and any potential chemical exposure in the application environment.

Part Context

This part belongs to the Boyd Laconia heat sink product line, which specializes in thermal management solutions for electronic systems. The 266298 designation corresponds to a specific configuration within the broader 590302 series of board-level heatsinks. These components are engineered to provide reliable heat transfer from semiconductor junctions to the surrounding environment through conductive and convective pathways.

Replacement Considerations

Direct substitutes may include other TO-220 clip-on heatsinks from Boyd or equivalent manufacturers with matching thermal resistance and physical footprint. Ensure replacement parts maintain the same vertical orientation and aluminum construction. Verify that alternative suppliers offer comparable anodized finishes and clip retention forces to ensure consistent thermal performance and mechanical stability.