2761021447

Overview

Fair-Rite Products Corp. part number 2761021447 is a ferrite bead designed for surface mount applications. It features a J-lead package configuration and operates within a frequency range of higher frequencies, specifically 250 MHz to 1000 MHz. The component exhibits an impedance of 94 ohms at 250 MHz and 61 ohms at 100 MHz, with a DC resistance of 1.2 milliohms. It is RoHS compliant and suitable for differential mode noise suppression.

Feature Summary

• Surface mount J-lead package design
• High-frequency operation from 250 MHz to 1000 MHz
• Low DC resistance for minimal signal loss
• RoHS compliant construction

Applications

• Differential mode noise suppression
• High-frequency circuit filtering
• EMI mitigation in surface mount assemblies

Procurement Notes

Verify the specific impedance value required for your application, as sources cite both 61 ohms at 100 MHz and 94 ohms at 250 MHz. Confirm the J-lead package type matches your PCB footprint. Ensure compliance with RoHS standards if required by your manufacturing process. Check datasheets for thermal handling capabilities during soldering.

Selection Notes

Select this component when high-frequency attenuation between 250 MHz and 1000 MHz is necessary. The low DC resistance makes it suitable for power or signal lines where voltage drop must be minimized. The J-lead package facilitates automated surface mount assembly. Verify that the impedance characteristics align with the specific noise frequencies present in the target circuit.

Part Context

This ferrite bead belongs to Fair-Rite's line of EMI suppression components. Fair-Rite Products Corp. manufactures these materials using proprietary formulations optimized for high-frequency performance. The company emphasizes quality control and engineering support for noise suppression applications across various industries.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Evaluate alternatives based on matching impedance curves, package dimensions, and current handling capabilities.