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2823360-8 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is 8P,2MM,SHRD HDR,DRRT,2.8,0.76AU,. Review the specifications below when checking this part for your BOM.
The TE Connectivity AMP Connectors part number 2823360-8 is an 8-position header connector from the AMPMODU 2MM series. It features a 0.079-inch (2.00mm) mating pitch and utilizes male pin contacts with gold plating for reliable signal transmission. Designed for surface mount installation, this right-angle connector supports board-to-board applications. The housing is constructed from thermoplastic material, rated for operation between -40°C and 125°C, and meets UL94 V-0 flammability standards.
Verify the specific ordering suffix to confirm contact plating thickness and packaging type. Ensure compatibility with mating receptacles regarding height and locking mechanisms. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process before finalizing procurement orders.
Select this component when a low-profile, surface-mount header with a 2.00mm pitch is required. Consider the right-angle orientation for space-constrained layouts. Verify that the 2A current rating and 125VAC/DC voltage limits align with the circuit requirements. Ensure the pick-and-place capabilities of the manufacturing line support the tape-reel packaging format.
This connector belongs to the AMPMODU 2MM family, which provides high-density interconnect solutions. The series is characterized by its small form factor and robust mechanical locking features. It complements other components in the same series, such as matching receptacles and wire housings, to create complete system interconnect architectures.
Direct substitutes may include other 8-position, 2.00mm pitch SMD headers from compatible manufacturers. Verify critical dimensions including body width, pin length, and standoff height. Ensure mating interface compatibility and identical thermal ratings to maintain system integrity without redesigning the PCB footprint.
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