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The 29C841DM/B is a specialty consumer circuit manufactured by Rochester Electronics, LLC. It is housed in a plastic SOIC-24 package with 24 terminals and measures 15.24 mm in length. The component operates within a temperature range of -40 °C to 85 °C. It contains one functional unit and utilizes a rectangular package shape made of plastic/epoxy material. The device is classified under JESD-30 code R-PDSO-G24 and JESD-609 code e0. It is not RoHS compliant and contains lead.
Verify that the specific lot matches the required leaded composition, as this part is not RoHS compliant. Confirm the SOIC-24 physical dimensions align with your PCB footprint requirements. Ensure the operating temperature range of -40 °C to 85 °C meets your environmental specifications. Cross-reference the JESD codes for compatibility with existing assembly processes. Validate that the single functional unit count satisfies the system architecture needs without requiring additional parallel components.
Select this component when a legacy consumer circuit interface is required in a compact surface-mount form factor. The SOIC-24 package offers a balance of pin density and board space efficiency. Consider the non-RoHS status if environmental regulations restrict lead-containing materials in your final product. The wide temperature range supports deployment in varied ambient conditions. Verify that the plastic epoxy construction is suitable for your reflow soldering profile and mechanical stress requirements during installation.
Rochester Electronics specializes in end-of-life semiconductors, guaranteeing performance to original OEM specifications. This component represents a sourced device from original factories, ensuring authenticity. The manufacturer maintains quality oversight through ISO standards. Products are often used to sustain production lines for equipment where original manufacturers have discontinued supply. This approach provides continuity for critical infrastructure and consumer goods manufacturing.
Direct substitute part numbers are not explicitly documented in the provided source data. Users should verify pinout compatibility and electrical characteristics against the original OEM datasheet before substitution. Physical package dimensions must match the existing PCB layout. Functional equivalence requires confirmation of the internal circuit topology. Consult official engineering change notices for any approved alternative listings.