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2MM-HSD-S06-HT-02-H-TB is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is 6P, AMPMODU 2 MM, SHROUDED HEADE. Review the specifications below when checking this part for your BOM.
The 2MM-HSD-S06-HT-02-H-TB is a 6-position board-to-board header from the AMPMODU 2MM series. It features a 2.00mm pitch, right-angle through-hole termination, and a shrouded design with polarizing keys. Rated for 250VAC and 2A current, it utilizes gold-plated mating contacts and tin-plated tail contacts made of phosphor bronze. The housing is black LCP rated UL94 V-0, operating between -40°C and 125°C.
Verify that the specific ordering suffix matches the required pin count, insulation height, and contact plating thickness. Confirm RoHS3 compliance status if restricted substances are prohibited. Ensure the right-angle mounting style aligns with the PCB layout constraints before finalizing procurement orders.
Select this component when a shrouded, polarized header is required for high-density board-to-board applications. The 2.00mm pitch allows for moderate trace density while maintaining robust mechanical stability. Consider the right-angle form factor for space-constrained vertical stacking scenarios requiring secure latching.
This part belongs to the AMPMODU 2MM Interconnection System, designed for general-purpose applications. It complements receptacles and other headers within the same series, offering a standardized solution for reliable electrical connections across various electronic industries.
Compatible substitutes include other TE Connectivity AMPMODU 2MM series headers with matching 6-position counts and right-angle shrouded designs. Verify identical pitch, current ratings, and insulation material properties before substitution.
The shrouded design incorporates polarizing keys to prevent incorrect mating orientation and protect contacts during insertion.
Yes, the LCP insulation supports operation up to 125°C, making it suitable for demanding thermal conditions.
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