2N6989UX/TR

Overview

The Microchip Technology 2N6989UX/TR is a hermetically sealed, ceramic surface-mount device consisting of four silicon NPN transistors. It utilizes a 20-pin package designed to minimize circuit board area and device weight. The component operates within a junction temperature range of -65°C to +200°C. Electrical characteristics include a collector-emitter breakdown voltage of 50V and a maximum continuous collector current of 800mA per transistor. The power dissipation capability is specified at 1W for the array. DC current gain (hFE) is guaranteed to be a minimum of 100 when measured at 150mA collector current and 10V collector-emitter voltage.

Feature Summary

• Hermetically sealed ceramic construction suitable for harsh environments
• Quad NPN configuration in a compact surface-mount footprint
• High thermal stability with extended operating temperature range

Applications

• General switching circuits
• Signal amplification stages
• Radio transmission systems
• Logic gate implementations

Procurement Notes

Verify that the specific suffix matches the required screening level, as military variants often require adherence to MIL-PRF-19500/559 standards. Confirm hermetic seal integrity requirements against the application environment. Ensure the 20-pin ceramic package dimensions align with the PCB layout constraints. Check for any specific burn-in or testing lot acceptance criteria mandated by the procurement specification.

Selection Notes

Select this component when space and weight are critical design factors requiring a hermetically sealed solution. Compare the 20-pin ceramic package against standard plastic packages if environmental sealing is not required. Evaluate the 800mA current rating against peak load demands. Consider the high junction temperature capability for applications involving elevated ambient temperatures or poor heat sinking conditions.

Part Context

This part belongs to the 2N6989U family of quad NPN transistor arrays. It shares core electrical specifications with through-hole versions but differs in packaging technology. The surface-mount variant targets designs prioritizing density over traditional leaded mounting methods. It serves as a direct functional replacement for discrete NPN transistor arrangements in space-constrained modules.

Replacement Considerations

Public confirmed substitute part numbers: JAN2N6989U/TR.