2PS1200R12KS4-4G-V

Overview

The 2PS1200R12KS4-4G-V is a stacked power module manufactured by Infineon Technologies. It belongs to the IGBT module category and utilizes the EconoPACK 3 housing design. The component features a fourpack configuration with specific physical dimensions of 122 mm in length and 62 mm in width. This module is designed for high-power applications requiring robust semiconductor integration within a compact form factor suitable for modern industrial power conversion systems.

Feature Summary

• Stacked power module architecture
• EconoPACK 3 housing design
• Fourpack configuration

Applications

• Industrial power conversion
• High-power semiconductor integration

Procurement Notes

Verify the exact datasheet specifications directly from Infineon Technologies before integration, as distributor descriptions may lack detailed electrical parameters. Confirm that the stacked power module configuration aligns with your thermal and mechanical design requirements. Ensure compatibility with existing cooling solutions due to the specific package dimensions.

Selection Notes

Select this component when a compact, high-density power solution is required. The EconoPACK 3 housing offers ease of integration for modern designs. Consider the fourpack configuration for specific circuit topologies. Evaluate the physical footprint against available board space, noting the 122 mm length and 62 mm width constraints.

Part Context

This part is part of Infineon's broader portfolio of power modules, specifically leveraging the EconoPACK 3 technology known for compactness. It sits alongside other IGBT modules like the FF1500R12IE5BPSA1 but differs in its stacked architecture and lower nominal current rating compared to large dual modules. It represents a specialized solution for specific power density needs.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify functional equivalence carefully if considering alternatives, particularly regarding the stacked architecture and EconoPACK 3 interface compatibility.