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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Mill-Max 304-11-103-41-780000 is a single-row IC socket featuring three positions with a 2.54mm pitch. It utilizes a press-fit termination method for board mounting, eliminating the need for soldering during installation. The connector accepts leads with diameters ranging from 0.381mm to 0.635mm. Gold plating ensures reliable contact performance within an operating temperature range of -55°C to +125°C.
Verify that the target PCB pads are compatible with press-fit termination requirements rather than standard through-hole soldering. Confirm that the mating component leads fall strictly within the specified diameter range of 0.381mm to 0.635mm to ensure proper mechanical retention and electrical contact. Ensure the application environment remains within the rated temperature limits.
Select this part when a solderless connection is required to prevent thermal damage to sensitive components during assembly. Choose this model over solderable alternatives if the design necessitates frequent insertion and removal cycles. Verify that the single-row configuration and three-position count align with the circuit layout requirements before finalizing the bill of materials.
This component belongs to the Mill-Max 304 series of interconnect sockets, which are characterized by high-reliability precision machining. The series offers various configurations for different pin counts and termination styles, serving as a standardized solution for connecting integrated circuits and other devices to printed circuit boards without permanent solder joints.
Consult official cross-reference tools for parametrically similar parts. Ensure any substitute maintains the same press-fit termination style and lead diameter acceptance range. Generic through-hole sockets are not direct replacements due to differing mechanical retention methods.
No, it uses a solderless press-fit termination method for board mounting.
It accepts leads with diameters between 0.381mm and 0.635mm (0.015" to 0.025").