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Product Detailed Parameters
- Description：CONN RCPT 21POS 0.1 GOLD PCB
- Series：304
- Mfr：Mill-Max Manufacturing Corp.
- Package：Bulk
- Connector Type：Receptacle
- Contact Type：Female Socket
- Style：Board to Board
- Number of Positions：21
- Number of Positions Loaded：All
- Pitch - Mating：0.100" (2.54mm)
- Number of Rows：1
- Row Spacing - Mating：-
- Mounting Type：Through Hole
- Termination：Press-Fit
- Fastening Type：Push-Pull
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：10.0µin (0.25µm)
- Insulation Color：Black
- Insulation Height：0.110" (2.79mm)
- Contact Length - Post：0.175" (4.45mm)
- Operating Temperature：-55°C ~ 125°C
- Material Flammability Rating：UL94 V-0
- Contact Finish - Post：Gold
- Mated Stacking Heights：-
- Ingress Protection：-
- Features：-
- Current Rating (Amps)：3A
- Voltage Rating：100V, 150VDC
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Overview
The Mill-Max 304-11-121-41-770000 is a 21-position IC and component socket receptacle designed for printed circuit board mounting. It features a 0.100-inch (2.54mm) mating pitch with gold-plated contacts offering a thickness of 10.0µin (0.25µm). The connector utilizes a push-pull fastening mechanism and supports through-hole installation via solder or crimp termination methods. Rated for 3A current, it operates within a temperature range of -55°C to 125°C. The housing is black with an insulation height of 0.110 inches (2.79mm) and meets UL94 V-0 flammability standards.
Feature Summary
- Push-pull fastening mechanism for secure connection retention
- Gold-plated contact surfaces ensuring reliable signal transmission
- Through-hole termination options including solder and crimp capabilities
Applications
- IC socketing applications requiring high-density connections
- Board-to-board interconnect systems
- Electronic assemblies needing robust thermal stability
Procurement Notes
Verify the specific ordering suffix against official Mill-Max documentation to ensure correct pin count and termination style compatibility. Confirm that the required quantity aligns with bulk packaging availability. Check regional distribution status as supply may be restricted in certain areas. Ensure the selected variant matches the intended PCB layout dimensions and mounting hole specifications before finalizing procurement orders.
Selection Notes
Select this component when a 21-position socket with 0.100-inch spacing is required. Ensure the design accommodates the 0.110-inch insulation height and through-hole mounting constraints. Verify that the operating environment stays within the specified -55°C to 125°C range. Confirm that the push-pull retention method suits the mechanical requirements of the assembly.
Part Context
This part belongs to the Mill-Max 304 series of IC and component sockets. The series offers various configurations for board-to-board and device socketing needs. Mill-Max Manufacturing Corp. produces these interconnect components using vertically integrated engineering processes. The 304 series is designed for reliability in demanding electronic environments.
Replacement Considerations
Consult official Mill-Max cross-reference guides for verified substitute part numbers. Do not assume generic equivalents match the specific 21-position configuration or push-pull retention mechanism. Verify dimensional and electrical compatibility before substituting.
