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Product Detailed Parameters
- Description：CONN RCPT 27POS 0.1 GOLD PCB
- Series：304
- Mfr：Mill-Max Manufacturing Corp.
- Package：Bulk
- Connector Type：Receptacle
- Contact Type：Female Socket
- Style：Board to Board
- Number of Positions：27
- Number of Positions Loaded：All
- Pitch - Mating：0.100" (2.54mm)
- Number of Rows：1
- Row Spacing - Mating：-
- Mounting Type：Through Hole
- Termination：Press-Fit
- Fastening Type：Push-Pull
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：10.0µin (0.25µm)
- Insulation Color：Black
- Insulation Height：0.110" (2.79mm)
- Contact Length - Post：0.250" (6.35mm)
- Operating Temperature：-55°C ~ 125°C
- Material Flammability Rating：UL94 V-0
- Contact Finish - Post：Gold
- Mated Stacking Heights：-
- Ingress Protection：-
- Features：-
- Current Rating (Amps)：3A
- Voltage Rating：100V, 150VDC
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Overview
The Mill-Max 304-11-127-41-780000 is a single-row interconnect socket designed for board-to-board applications. It features a .100 inch (2.54mm) pitch and accepts lead diameters ranging from .015 to .025 inches (0.381 to 0.635mm). The component utilizes a solderless press-fit termination method for secure mounting. Contact surfaces are finished with gold plating, measuring 10.0 microinches (0.25 micrometers) in thickness, to ensure reliable conductivity.
Feature Summary
- Solderless press-fit termination mechanism for rapid assembly
- Gold-plated contacts for enhanced signal integrity
- Single-row receptacle configuration
Applications
- Board-to-board interconnections
- Electronic device circuit integration
- Reliable electrical connection points
Procurement Notes
Verify the specific part number against official Mill-Max documentation to confirm compatibility with your design requirements. Ensure that the press-fit termination method aligns with your PCB manufacturing capabilities. Cross-reference the lead diameter acceptance range (.015-.025 inches) with your target components. Confirm that the single-row layout fits within your available board space constraints before finalizing procurement decisions.
Selection Notes
Select this component when a solderless press-fit solution is required for board-to-board connections. The .100 inch pitch accommodates standard spacing requirements. Verify that the target leads fall within the specified diameter range of .015 to .025 inches. Consider the gold contact finish for applications demanding high reliability. Ensure the single-row format meets the density needs of the specific electronic assembly.
Part Context
This component belongs to the Mill-Max 304 series of interconnect sockets. The series offers various configurations for different board-to-board needs. The 304-11-127 variant specifically addresses applications requiring a solderless press-fit interface. It provides a standardized solution for connecting circuit boards without traditional soldering processes.
Replacement Considerations
Consult official Mill-Max documentation for confirmed substitute part numbers. Verify that any alternative maintains the same .100 inch pitch and press-fit termination style. Ensure the replacement accepts the same lead diameter range. Check compatibility with existing board layouts and contact specifications.
