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304-11-134-41-780000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 34POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 304-11-134-41-780000 is a single-row IC socket featuring 34 positions with a 0.100-inch (2.54mm) pitch. It utilizes through-hole mounting and gold-plated contacts for reliable signal transmission. The component supports a rated current of 3A and operates within a temperature range of -55°C to +125°C. Designed for board-to-board interconnection, it offers high durability and low contact resistance suitable for demanding electronic applications.
Verify the specific pin count and pitch against design requirements before ordering. Confirm that the through-hole footprint matches the target PCB layout. Ensure operating temperatures align with the specified -55°C to +125°C range. Check for RoHS compliance if required by project standards. Validate mechanical retention needs for the selected application environment.
Select this model when a 34-position single-row socket is required. Consider the 0.100-inch pitch for standard spacing compatibility. Evaluate the through-hole mounting style against surface-mount alternatives. Assess the gold plating thickness for expected mating cycles. Compare current ratings against circuit load requirements.
This part belongs to the Mill-Max 304 series of interconnect sockets. The series provides various configurations for different pin counts and mounting styles. These components are designed for high-reliability applications requiring stable electrical connections. The 304 series is widely used in industrial and commercial electronics.
Direct substitutes may include other 34-position single-row sockets from Mill-Max or compatible manufacturers. Verify identical pitch, pin count, and mounting type. Ensure equivalent current and voltage ratings. Check mechanical dimensions for board space constraints.
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