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304-11-154-41-780000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 54POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max Manufacturing Corp. model 304-11-154-41-780000 is a vertical header connector designed for through-hole mounting. It features four positions with a 0.050-inch (1.27mm) pitch. The contacts are round male pins with gold plating, offering a mating contact length of 0.118 inches and a column contact length of 0.114 inches. The overall contact length measures 0.319 inches, while the insulation height is 0.087 inches. This component belongs to the 850 series and utilizes a push-pull fastening type.
Verify the specific part number against official Mill-Max documentation to ensure compatibility with design requirements. Confirm that the through-hole mounting style and vertical orientation align with the target PCB layout. Check for any updated revision history or packaging specifications in the latest datasheet before finalizing procurement orders.
Select this component when a low-profile vertical header with precise 1.27mm spacing is required. The gold plating ensures durability and conductivity for standard signal applications. Ensure the board thickness accommodates the specified insulation height and contact lengths for proper mating with corresponding sockets or cables.
This connector is part of the Mill-Max 850 series, which specializes in high-density interconnect solutions. The series offers various configurations tailored for different mounting styles and pin counts. The 304-11-154-41-780000 variant specifically addresses needs for compact, reliable vertical connections in space-constrained electronic assemblies.
Consult official Mill-Max cross-reference guides for verified substitute part numbers. Ensure any replacement maintains identical pin count, pitch, and mounting characteristics to preserve mechanical and electrical integrity within the existing system design.
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