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304-13-125-41-780000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 25POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 304-13-125-41-780000 is a precision interconnect socket designed for board-to-board applications. It features a 125-position receptacle configuration with a 0.100 inch (2.54 mm) mating pitch. The component utilizes through-hole termination and gold-plated contacts to ensure reliable signal transmission. This single-row connector is engineered for high-density mounting on printed circuit boards, providing stable mechanical support and electrical continuity for integrated circuits and other components requiring secure socketing interfaces.
Verify the specific part number against official Mill-Max documentation to confirm pin count and termination style. Ensure compatibility with mating male pins regarding pitch and contact geometry. Check for RoHS compliance status and environmental ratings relevant to the target application before finalizing procurement orders.
Select this component when a high-pin-count, single-row socket is required for through-hole mounting. The 0.100-inch pitch is standard for many legacy and industrial interfaces. Consider the physical height and insulation material properties if thermal or spatial constraints are present in the design layout.
This part belongs to the Mill-Max 304 series of IC and component sockets. The series is known for manufacturing high-reliability, precision-machined interconnect components. These sockets are widely used in industries demanding durable and consistent electrical connections for various electronic assemblies.
Direct substitutes must match the 125-position count, 0.100-inch pitch, and through-hole termination. Verify that alternative manufacturers offer identical mechanical dimensions and contact plating specifications to ensure functional interchangeability without redesigning the PCB footprint.
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