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304-13-163-41-780000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 63POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 304-13-163-41-780000 is a precision-machined IC socket component designed for high-reliability interconnect applications. It features a single row of contacts with a standard 0.100-inch (2.54 mm) pitch, accommodating 16 pins in total. The unit utilizes through-hole mounting for secure PCB attachment and employs press-fit termination methods to ensure stable electrical connections. Constructed with gold-plated contacts, it offers low contact resistance and corrosion resistance suitable for demanding environments.
Verify the specific ordering suffix against official Mill-Max documentation to confirm exact pin count, contact plating thickness, and termination style. Ensure compatibility with target IC footprint dimensions and PCB hole specifications before procurement. Confirm RoHS compliance status and current availability through authorized channels as supply conditions may vary.
Select this component when a single-row, 16-pin socket with 0.100-inch pitch is required. Prioritize models with gold plating for applications involving frequent mating cycles or corrosive environments. Ensure the press-fit termination aligns with the manufacturing process capabilities and PCB design constraints for optimal installation.
This part belongs to the Mill-Max 304 series of custom and standard IC sockets. The series is known for high-quality machining and plating options, catering to industries requiring dependable interconnect solutions. Mill-Max Manufacturing Corp. specializes in precision interconnect components, offering extensive customization within their standard product lines.
Consult official Mill-Max cross-reference guides for direct substitutes. Verify that any alternative maintains identical pin count, pitch, and termination type to ensure functional equivalence without redesigning the host PCB layout.
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