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305-022-521-203 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 22POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-022-521-203 is a standard card edge connector from the 305 series, designed for dual female termination with 22 positions. It features a 0.156-inch (3.96 mm) pitch and utilizes gold-plated copper alloy contacts housed in a green thermoplastic polyester insulator. The component supports panel mounting via solder pin termination and accommodates board thicknesses ranging from 0.054 to 0.070 inches. It operates within a temperature range of -40°C to +105°C and carries RoHS3 compliance.
Verify the specific ordering suffix against official EDAC documentation to confirm exact plating thickness and material specifications. Confirm that the requested quantity aligns with manufacturer standard packaging requirements. Ensure compatibility with target PCB thickness limits before finalizing procurement orders to prevent mechanical fit issues.
Select this model when a dual-row female header with a 3.96 mm pitch is required for panel-mounted applications. Consider the 5 A current rating and 1800 VACrms insulation voltage for circuit safety margins. Evaluate the -40°C to +105°C operating range against environmental conditions to ensure long-term reliability in the intended deployment scenario.
This component belongs to the EDAC 305 series of standard card edge connectors, which are engineered for high-reliability interconnect applications. The series offers various position counts and mounting styles, catering to diverse industrial and commercial needs. EDAC designs these connectors to withstand demanding operational environments while maintaining consistent electrical performance over time.
Consult official EDAC cross-reference guides for verified substitute part numbers. Ensure any replacement maintains identical pitch, row count, and mounting style specifications. Verify that alternative components meet the same thermal and electrical ratings to guarantee functional equivalence in existing designs.
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