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305-080-500-558 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 80POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-080-500-558 is a standard card edge connector from the 305 series, designed for dual-edge board applications. It features 80 positions with a 3.96 mm (0.156 inch) pitch and supports PCB thicknesses between 1.37 mm and 1.78 mm. The connector utilizes gold-plated copper alloy contacts with a 10.0 µin (0.25 µm) finish and half-beam contact types. Rated for 5 A current, it employs solder lug termination and panel mount installation. The housing is green thermoplastic polyester, operating within -40°C to 105°C.
Verify the specific suffix code against the manufacturer's official ordering guide to confirm exact mechanical dimensions and termination style. Ensure compatibility with the target PCB thickness range of 1.37 mm to 1.78 mm. Confirm that the panel mounting requirements align with the vertical installation angle and lug termination type specified in the datasheet before finalizing procurement.
Select this component when a dual-edge connector with a 3.96 mm pitch is required for panel-mounted applications. The 80-position count suits high-density interface needs. Verify that the 5 A current rating and -40°C to 105°C operating temperature range meet the environmental and electrical demands of the specific system design.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting styles, all sharing common electrical characteristics like 5 A ratings and gold-plated contacts. The 305-080 variant specifically provides 80 positions, fitting into the mid-range density options available within this product family.
Cross-reference with other EDAC 305 series parts having identical 3.96 mm pitch and 80 positions. Verify that alternative models match the dual-edge, panel-mount, and solder-lug specifications to ensure mechanical and electrical interchangeability without redesigning the host assembly.
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