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305-080-521-278 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 80POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-080-521-278 is a standard card edge connector designed for panel mount applications. It features 80 positions with a contact spacing of 0.156 inches (3.96 mm) and a row spacing of 0.140 inches (3.56 mm). The connector accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). It utilizes gold-plated copper alloy contacts and solder pin termination. The unit is classified as a dual-edge female connector.
Verify the specific ordering suffix to ensure compatibility with required PCB thickness and mounting hardware. Confirm that the dual-edge female specification matches the target application design. Check regional availability status, as distribution channels may vary by location. Ensure the selected variant meets all environmental compliance requirements for the intended deployment environment.
Select this component when a high-density connection with 80 positions is required on a single connector. The 3.96 mm pitch allows for substantial current carrying capacity compared to finer pitches. Consider the panel mount requirement and vertical orientation during mechanical design. Verify that the target PCB thickness aligns with the 1.57 mm nominal specification for proper engagement.
This part belongs to the EDAC 305 series of card edge connectors. The series offers various position counts and mounting options. The 305 series is characterized by its low profile and use of gold-plated contacts. It serves as a standard solution for connecting edge-mounted circuit boards in various electronic assemblies.
Direct substitutes within the same series include parts with identical positioning and contact specifications but different suffixes indicating variations in mounting hardware or insulation color. Cross-series replacement requires verification of pitch, row spacing, and board thickness compatibility.
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