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305-080-556-512 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 80POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-080-556-512 is a standard card edge connector from the 305 series, designed for dual-edge board applications. It features 80 positions with a 3.96 mm (0.156 inch) pitch and a 3.56 mm row spacing. The connector utilizes gold-plated copper alloy contacts and a green thermoplastic polyester housing. Rated for 5 A current, it supports panel mount installation at a vertical angle. The unit accommodates PCB thicknesses between 1.37 mm and 1.78 mm and operates within a temperature range of -40°C to +105°C.
Verify the specific suffix codes against official EDAC documentation to confirm exact plating thickness and flange dimensions. Ensure compatibility with target PCB thickness specifications before procurement. Confirm RoHS compliance status through manufacturer datasheets. Validate that the selected variant matches the required current rating and operating temperature range for the intended application environment.
Select this component when dual-edge connectivity with high pin counts is required. The 3.96 mm pitch suits applications needing wider spacing for reduced crosstalk. Consider the vertical panel mount style for chassis-based designs. Evaluate the 5 A rating against peak load requirements. Ensure the green housing color meets visual identification standards if applicable.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting styles. The 305-080-556-512 specifically addresses high-density dual-edge needs. It complements other 305 variants differing in position count or flange configurations. The series is widely used in industrial and commercial electronic assemblies.
Consult EDAC official substitution guides for direct replacements. Verify mechanical fit and electrical parameters match exactly. Cross-reference with distributor databases for equivalent parts. Ensure alternative components meet the same thermal and current ratings.
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