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305-082-556-508 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 82POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-082-556-508 is a standard card edge connector from the 305 series, designed for dual-edge female connections. It features 82 positions with a 3.96 mm (0.156 inch) pitch and supports two contact rows. The connector utilizes gold-plated copper alloy contacts and a green thermoplastic insulator. It is rated for 5 A current and operates within a temperature range of -40°C to +105°C. Designed for panel mount installation, it accommodates PCB thicknesses between 1.37 mm and 1.78 mm.
Verify the specific suffix codes against the manufacturer's official ordering guide to confirm exact plating thickness and material specifications. Ensure compatibility with the target PCB edge card dimensions and mounting hole patterns before procurement. Cross-reference the RoHS compliance status with current regulatory requirements for the intended market.
Select this component when a high-density dual-row connection is required with a 3.96 mm spacing. Consider the 5 A current rating and operating temperature limits for thermal management. Verify that the panel mount style aligns with the mechanical enclosure design and that the gold plating meets corrosion resistance needs.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting options. The 305-082-556-508 specifically addresses applications requiring 82 positions in a dual-row format. It shares common design principles with other parts in the series, such as consistent pitch and contact materials.
Direct substitutes include other EDAC 305 series parts with matching 82-position dual-row configurations. Verify equivalent pitch, current ratings, and mounting styles. Consult the official EDAC cross-reference documentation for approved alternative part numbers.
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