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306-012-500-103 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 24POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC 306-012-500-103 is a standard card edge connector from the 306 series, designed for vertical panel mounting. It features a dual female configuration with 24 positions arranged in two rows. The connector utilizes a 0.156-inch (3.96 mm) centerline pitch and supports a maximum operating temperature of +105°C and a minimum of -40°C. Electrical specifications include a current rating of 5 amps and an insulation resistance of 5 GOhms. The housing is constructed from green thermoplastic material.
Verify the specific suffix codes against official EDAC documentation to confirm exact plating thickness and housing color variations. Ensure that the selected variant matches the required PCB thickness tolerance and panel cutout dimensions for proper mechanical fit. Cross-reference the manufacturer part number with authorized distributor catalogs to confirm current availability status and lead times before finalizing procurement orders.
Select this component when a dual-row female card edge connector is required for vertical panel mounting applications. Consider the 0.156-inch pitch and 24-position count to match the target printed circuit board design. Evaluate the thermoplastic housing material and gold-plated contacts for suitability in environments demanding moderate temperature resistance and reliable electrical performance up to 5 amps.
This component belongs to the EDAC 306 series of standard card edge connectors. The series offers various position counts and mounting styles to accommodate diverse electronic assembly needs. The 306 series is characterized by its use of thermoplastic housings and standardized spacing, providing a versatile solution for connecting edge-card modules in industrial and commercial electronic devices.
No public confirmed substitute part numbers are available in the provided documentation.
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