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306-014-400-103 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 28POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 306-014-400-103 is a dual-edge female card edge connector designed for panel mount and through-hole termination. It features 28 positions with a 0.156-inch (3.96mm) pitch, arranged in a single row per side. The contacts are made of copper alloy with tin plating, housed in green thermoplastic polyester insulation. It supports board thicknesses from 0.054 to 0.070 inches and operates within a temperature range of -40°C to 105°C.
Verify the specific ordering suffix against the manufacturer's current 306 Series Ordering Guide to ensure compatibility with required contact plating and mounting variations. Confirm that the target PCB thickness falls within the specified 0.054 to 0.070 inch range to guarantee proper mechanical retention and electrical contact integrity during assembly and operation.
Select this component when a dual-edge female connector with a 3.96mm pitch is required for panel-mounted applications. Ensure the design accommodates through-hole soldering processes and verifies compatibility with the specified operating temperature range. Consider alternative series if higher pin counts or different termination styles are needed for the specific system architecture.
This part belongs to the EDAC 306 Series of standard card edge connectors, which offers various configurations for dual-edge applications. The series provides options for different contact materials, plating finishes, and mounting styles to suit diverse industrial and commercial electronic requirements while maintaining consistent dimensional standards.
Consult the official EDAC 306 Series cross-reference documentation for verified substitute part numbers. Direct replacements must match the 28-position count, 0.156-inch pitch, and dual-edge female configuration to maintain mechanical and electrical interface compatibility without redesigning the host PCB footprint.
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