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306-015-520-158 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 30POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 306-015-520-158 is a dual-edge female card edge connector from the 306 Series, designed for panel and through-hole mounting. It features 30 positions with a 0.156-inch (3.96mm) contact spacing across two rows. The contacts are made of copper alloy with gold plating and utilize a cantilever type termination. The insulator is constructed from thermoplastic polyester, rated for operation between -40°C and 105°C. This component supports non-specified dual-edge cards with thicknesses ranging from 0.054 to 0.070 inches.
Verify the specific ordering suffix against the manufacturer's official 306 Series Ordering Guide to ensure compatibility with required card guide solutions and termination types. Confirm that the selected variant matches the necessary environmental ratings and mechanical specifications for the intended application before finalizing procurement orders.
Select this connector when a 0.156-inch pitch dual-edge interface is required for panel-mounted applications. Ensure the target PCB thickness falls within the specified range of 0.054 to 0.070 inches. Consider the operating temperature range and insulation material properties to guarantee performance under expected thermal conditions.
This component belongs to the EDAC 306 Series, which offers various contact spacings and mounting options. The series provides multiple card guide solutions and extra row terminations to accommodate diverse design requirements. It is part of a broader portfolio including specialized connectors for industrial and commercial sectors.
Consult the official EDAC 306 Series cross-reference documentation for verified substitute part numbers. Ensure any replacement maintains identical pin count, pitch, and mounting style to preserve mechanical fit and electrical continuity without redesigning the host assembly.
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