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306-015-521-103 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 30POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 306-015-521-103 is a dual female card edge connector featuring 30 positions with a 0.156-inch (3.96mm) contact spacing. It utilizes copper alloy contacts with gold plating for reliable signal transmission. Designed for panel mount and through-hole soldering, the unit accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57mm). The insulator body is constructed from green thermoplastic polyester, ensuring durability in standard operating environments.
Verify that the specific order matches the 306-015-521-103 designation to ensure correct pin count and plating type. Confirm compatibility with the target PCB thickness of 0.062 inches before integration. Check RoHS compliance status if required by project specifications. Ensure storage conditions maintain component integrity prior to assembly.
Select this component when a dual-row connection with 0.156-inch pitch is required for vertical mounting applications. The gold plating makes it suitable for environments where oxidation resistance is critical compared to tin-plated alternatives. Consider the through-hole installation requirement against surface-mount options during design phase.
This part belongs to the EDAC 306 Series, which specializes in card edge connectors with 0.156-inch spacing. The series offers various position counts and termination styles. The 306-015 variant specifically addresses needs for moderate density connections requiring durable gold contact surfaces and standard thermoplastic insulation materials.
Cross-reference with other EDAC 306 series parts sharing the same 0.156-inch pitch and dual-row layout. Verify dimensional compatibility with existing panel cutouts and PCB edge guides. Ensure substitute components match the gold plating specification and through-hole termination requirements.
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