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306-015-521-158 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 30POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 306-015-521-158 is a dual-edge female card edge connector from the 306 Series, featuring 15 positions with a 0.156-inch (3.96mm) contact spacing. It utilizes gold-plated cantilever contacts and a green thermoplastic polyester insulator. Designed for panel mount through-hole installation, it accepts PCBs with thicknesses ranging from 0.054 to 0.070 inches. The component operates within a temperature range of -40°C to 105°C and includes flange features for secure mounting.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact pin count, contact spacing, and termination style. Ensure compatibility with target PCB thickness specifications before procurement. Confirm RoHS compliance status if required by project regulations. Cross-reference the manufacturer part number with distributor listings to validate current availability and lead times.
Select this connector when a dual-edge interface with 0.156-inch spacing is required for panel-mounted applications. Ensure the target printed circuit board thickness falls within the specified operational range. Verify that the housing material and temperature ratings align with the environmental conditions of the intended deployment scenario.
This component belongs to the EDAC 306 Series, which specializes in standard card edge connectors. The series offers various position counts and configurations tailored for diverse industrial and commercial applications. The 306 Series is known for its durability and consistent performance in high-reliability electronic assemblies.
Consult the official EDAC 306 Series ordering guide for direct substitutes with differing pin counts or spacing. No alternative part numbers are confirmed as functional equivalents in available public documentation.
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