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306-019-500-102 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 38POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 306-019-500-102 is a standard card edge connector header featuring a single centerline row with 38 positions and a contact spacing of 3.96 mm (0.156 inches). Designed for panel mount installation, it accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inches). The unit utilizes copper alloy contacts with gold plating and employs a low-profile thermoplastic insulator body.
Verify the specific suffix codes against official EDAC documentation to confirm exact pin count and termination style compatibility. Ensure that the ordering part number matches the required board thickness tolerance of 1.57 mm. Cross-reference the manufacturer's latest datasheet to confirm current availability status and any recent product change notifications before finalizing procurement orders.
Select this component when a single-row card edge interface with 3.96 mm pitch is required for panel-mounted applications. It is suitable for designs necessitating a low-profile form factor while maintaining robust electrical connections through gold-plated contacts. Confirm that the mating PCB thickness aligns with the specified 1.57 mm nominal dimension for optimal mechanical retention.
This component belongs to the EDAC 306 series of standard card edge connectors. The series is characterized by its use of thermoplastic materials and copper alloy contacts, designed for general-purpose electronic interconnections. The 306 series provides a reliable solution for connecting edge-card modules to main systems in various industrial and commercial environments.
Consult official EDAC substitution guides for direct replacements. Verify that alternative parts maintain identical 3.96 mm pitch, 38-position count, and panel mount orientation to ensure mechanical and electrical compatibility without redesigning the host PCB.
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