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The EDAC Inc. model 306-020-400-101 is a dual-edge card edge connector receptacle designed for vertical panel mount applications. It features 20 positions with a contact spacing of 3.96 mm (0.156 inches). The unit accepts printed circuit boards with a nominal thickness of 1.57 mm. Contacts are constructed from copper alloy and terminated via solder pin connections. The housing utilizes green thermoplastic polyester insulation, providing an insulation resistance of 5 GOhms. The component supports a current rating of 5 A and operates within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct termination style, contact plating, and mounting hardware options. Confirm that the selected variant matches the required board thickness and pitch specifications for your application. Cross-reference the part number with the latest datasheet to validate compliance with current environmental standards and material compositions before finalizing procurement orders.
Select this component when a dual-edge receptacle with 3.96 mm pitch is required for vertical panel mounting. Ensure the application environment remains within the specified -40°C to +105°C operating temperature range. Verify that the target PCB thickness aligns with the 1.57 mm nominal requirement. Consider the 5 A current rating and 5 GOhms insulation resistance to confirm suitability for the intended electrical load and isolation requirements.
This part belongs to the EDAC 306 series of standard card edge connectors. The series provides various row configurations, contact spacings, and termination options. The 306-020-400-101 specifically denotes a 20-position dual-edge variant with thermoplastic polyester insulation and tin-plated contacts, distinguishing it from single-row or different pitch alternatives within the broader product family.
Consult official substitution guides for compatible equivalents. No public confirmed substitute part numbers are available in the provided source data.