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The EDAC Inc. 306-021-520-103 is a standard card edge connector designed for vertical panel mount applications. It features a dual female configuration with 42 total positions arranged in two rows of 21 contacts each. The connector utilizes a 0.156-inch (3.96mm) contact spacing and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57mm). Contacts are constructed from copper alloy with a gold plating finish to ensure reliable electrical performance. The insulator body is made of thermoplastic material and is colored green, providing a low-profile design suitable for space-constrained installations.
Verify the specific ordering suffix matches the required pin count and contact spacing before procurement. Confirm that the thermal rating and current capacity align with the application's electrical load requirements. Ensure the panel cutout dimensions accommodate the connector's mounting flanges and height specifications to prevent mechanical interference during assembly.
Select this component when a vertical orientation and dual-row interface are required for a 21-position single-sided card. The 0.156-inch pitch dictates the trace routing density on the mating PCB. Consider the gold plating thickness for durability if frequent insertion cycles are expected. Verify that the green insulator color meets any visual identification standards within the assembly.
This part belongs to the EDAC 306 series of standard card edge connectors. The series offers various configurations in terms of position count, row arrangement, and contact spacing. The 306-021-520-103 specifically addresses needs for moderate-density connections requiring robust panel mounting capabilities and standardized dimensional tolerances for interchangeability within similar industrial frameworks.
Direct substitutes must match the 42-position dual female layout, 0.156-inch pitch, and vertical panel mount form factor. Verify that alternative manufacturers provide identical PCB thickness acceptance ranges and contact material specifications to maintain signal integrity and mechanical fit without redesigning the host enclosure.