306-021-520-104

Overview

The EDAC Inc. 306-021-520-104 is a standard card edge connector designed for vertical panel mounting applications. It features a dual female configuration with 42 positions arranged in two rows of 21 contacts each. The connector utilizes a 0.156-inch (3.96mm) contact spacing and is constructed with a thermoplastic insulator body. It accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57mm). The contacts are made from copper alloy and feature a gold plating finish to ensure reliable electrical performance.

Feature Summary

• Vertical panel mount design for secure installation
• Dual female contact configuration for board insertion
• Gold-plated copper alloy contacts for conductivity
• Low profile insulator body construction

Applications

• Industrial control systems requiring robust interconnects
• Test and measurement equipment interfaces
• Telecommunications hardware assemblies
• General purpose electronic device backplanes

Procurement Notes

Verify the specific ordering suffix against the manufacturer datasheet to confirm pin count, contact spacing, and termination style match the design requirements. Ensure the selected variant supports the target PCB thickness of 0.062 inches. Confirm RoHS compliance status if environmental regulations apply to the final assembly. Cross-reference the part number with official distributor catalogs to validate current availability and lead times before finalizing procurement plans.

Selection Notes

Select this component when a vertical mounting solution with 0.156-inch spacing is required. The dual row layout accommodates 42 signals within a compact footprint. Verify that the housing material and temperature rating suit the operational environment. Consider the panel cutout dimensions and flange specifications to ensure mechanical compatibility during integration into the enclosure structure.

Part Context

This component belongs to the EDAC 306 series of standard card edge connectors. The series offers various configurations tailored for different board thicknesses and contact densities. The 306-021-520-104 specifically addresses applications needing high-density connections with vertical orientation. It serves as a critical interface between the circuit board and the system chassis or external cabling infrastructure.

Replacement Considerations

Direct substitutes must maintain identical 0.156-inch spacing, 42-position count, and vertical panel mount form factor. Verify mechanical dimensions and mating force characteristics to ensure interchangeability without redesigning the host PCB or enclosure.