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The EDAC Inc. 306-021-520-178 is a standard card edge connector receptacle featuring 42 positions arranged in a dual configuration with a 3.96 mm (0.156 inch) pitch. Designed for through-hole mounting, it utilizes gold-plated copper alloy contacts and a green thermoplastic polyester insulator. The component supports a current rating of 5 A and operates within a temperature range of -40°C to +105°C. It accommodates board thicknesses between 1.37 mm and 1.78 mm, ensuring reliable electrical interconnection for specified edge cards.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact pin count, plating thickness, and flange specifications. Ensure compatibility with the target PCB stack-up and mating card dimensions before procurement. Confirm RoHS compliance status and availability through authorized channels, as lead times may vary based on manufacturing schedules.
Select this component when a dual-row card edge interface with a 3.96 mm pitch is required. The 42-position layout suits applications needing extensive I/O or data lines within a single connector footprint. Consider the through-hole mounting style for superior mechanical strength compared to surface-mount alternatives. Verify that the operating temperature range meets the environmental demands of the final assembly.
This part belongs to the EDAC 306 series, which specializes in standard card edge connectors. The series offers various position counts and mounting options to accommodate diverse board design requirements. The 306-021-520-178 specifically addresses needs for dual-sided connectivity with standardized spacing, fitting into broader industrial and commercial electronic systems requiring durable edge-board interfaces.
Direct substitutes must match the 42-position dual female configuration and 3.96 mm pitch. Verify that alternative components support the same 5 A current rating and -40°C to +105°C temperature range. Ensure mechanical compatibility, including through-hole termination and housing material properties, to maintain assembly integrity.