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The EDAC Inc. 306-022-420-107 is a standard card edge connector receptacle from the 306 series. It features 22 positions with a 3.96 mm pitch and supports a maximum board thickness of 1.57 mm. The component utilizes gold-plated copper alloy contacts for reliable signal transmission and operates within a temperature range of -40°C to +105°C. Designed for panel mount installation, it offers vertical orientation and includes M3-0.5 threaded mounting features. The housing is constructed from thermoplastic polyester, ensuring durability in industrial environments.
Verify the specific contact plating configuration against official datasheets, as distributor listings may vary between gold and tin finishes. Confirm that the required PCB thickness aligns with the 1.57 mm specification. Ensure the mounting style matches the panel mount requirement with appropriate threaded inserts. Cross-reference the manufacturer part number directly with EDAC documentation to avoid substitution errors.
Select this component when a vertical card edge interface with a 3.96 mm pitch is required. Consider the 22-position count and single-row layout for space-constrained panel applications. Evaluate the thermal rating of +105°C against operational requirements. Verify compatibility with the target PCB edge thickness and mounting hardware constraints before finalizing the design.
This part belongs to the EDAC 306 series of standard card edge connectors. The series is characterized by its 3.96 mm contact spacing and versatile mounting options. Components in this family are designed for general-purpose electronic interconnections, offering a balance of mechanical stability and electrical performance for various industrial and commercial applications.
Direct substitutes must maintain the 3.96 mm pitch, 22-position count, and vertical panel mount form factor. Verify that alternative parts support the same PCB thickness and thermal ratings. Check for identical mounting hole patterns and thread specifications to ensure mechanical compatibility without redesigning the enclosure.