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The EDAC Inc. model 306-022-520-158 is a card edge connector from the 306 Series, featuring 22 positions with a dual-edge female configuration. It utilizes a 0.156-inch (3.96 mm) contact spacing and accepts printed circuit boards with a thickness range of 0.054 to 0.070 inches (1.37 mm to 1.78 mm). The connector employs gold-plated cantilever spring contacts for reliable signal transmission. Designed for panel mounting via flanges, it operates within a temperature range of -40°C to 105°C and uses a green thermoplastic polyester insulator.
Verify the specific ordering suffix against the manufacturer's official 306 Series Ordering Guide to confirm exact pin count, termination style, and insulation color. Ensure compatibility with target PCB thickness specifications before procurement. Confirm RoHS compliance status and environmental certifications required for the end application. Cross-reference the manufacturer part number with distributor catalogs to avoid substitution errors.
Select this component when a dual-edge female connector with 0.156-inch spacing is required for panel-mounted applications. Consider the operating temperature range and material compatibility with the target PCB substrate. Evaluate mechanical stability needs against the flange mounting options provided by the series. Compare alternative series if different board thickness tolerances or contact row configurations are necessary.
This component belongs to the EDAC 306 Series, which specializes in card edge connectors designed for robust industrial and commercial environments. The series offers various position counts and mounting styles, providing standardized solutions for high-reliability interconnect needs. The 306 Series is characterized by its durable construction and consistent performance across diverse electronic assemblies.
Consult the official EDAC 306 Series cross-reference documentation for verified substitute part numbers. Ensure any replacement matches the original pitch, position count, and mounting configuration. Verify that alternative components meet identical thermal and mechanical requirements.