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The EDAC Inc. 306-023-421-108 is a standard card edge connector from the 306 series, designed for panel mount applications. It features a dual female configuration with 46 positions arranged in two rows. The connector utilizes a 0.156-inch (3.96 mm) pitch and accepts board thicknesses ranging from 0.054 to 0.070 inches (1.37 to 1.78 mm). Contact plating is tin, and the insulating material is green thermoplastic polyester. It supports through-hole termination and operates within a temperature range of -40°C to 105°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure compatibility with required termination types and mounting styles. Confirm that the tin-plated contacts meet the environmental requirements for the intended application. Cross-reference the part number with the latest EDAC Inc. documentation to validate current availability and compliance status before finalizing procurement orders.
Select this component when a dual-row card edge interface with a 3.96 mm pitch is required. Ensure the mating PCB thickness falls within the specified 1.37 mm to 1.78 mm range. Consider the tin plating for general-purpose applications where high corrosion resistance is not critical. Verify that the panel mount form factor aligns with the mechanical design constraints of the enclosure.
This part belongs to the EDAC 306 series of standard card edge connectors. The series offers various configurations including different row counts, pin spacings, and termination options. The 306-023-421-108 specifically addresses needs for dual-sided edge connections with a moderate pin count, providing a standardized solution for vertical board-to-board or board-to-panel interfaces.
Consult the EDAC Inc. 306 Series Ordering Guide for direct substitutes with identical electrical characteristics but different plating or mounting variations. Generic equivalents may exist but require verification of dimensional tolerances and contact force specifications to ensure functional interchangeability without redesigning the host assembly.