306-023-500-178

Overview

The EDAC Inc. 306-023-500-178 is a standard card edge connector designed for vertical panel mounting applications. It features a dual female configuration with 46 positions arranged in two rows, providing a total of 92 contact points. The connector utilizes a 3.96 mm (0.156 inch) pitch and is constructed with thermoplastic polyester insulation. It accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). The contacts are made from copper alloy and feature gold plating to ensure reliable signal transmission.

Feature Summary

• Dual female contact configuration for secure board retention
• Vertical panel mount installation style for chassis integration
• Gold-plated copper alloy contacts for corrosion resistance
• Thermoplastic polyester insulator body for durability

Applications

• Industrial control system interconnects
• Telecommunications equipment backplanes
• Test and measurement instrument interfaces
• Computing hardware peripheral connections

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm pin count, contact spacing, and termination type. Ensure compatibility with the target PCB thickness and panel cutout dimensions before procurement. Confirm RoHS compliance status if required by project specifications. Cross-reference the part number with authorized distributors to validate current availability and lead times.

Selection Notes

Select this component when a high-density dual-row connection is required for vertical panel mounting. The 3.96 mm pitch offers robust mechanical stability compared to finer pitches. Verify that the application environment falls within the specified operating temperature range. Consider the gold plating thickness if high-cycle mating is anticipated. Ensure the housing material meets the chemical resistance requirements of the deployment environment.

Part Context

This part belongs to the EDAC 306 series of standard card edge connectors. The series is characterized by its versatility in handling various board thicknesses and row configurations. The 306 series is widely used in industrial and commercial electronics where reliable, high-pin-count connections are necessary. It represents a standard solution for modular system architectures requiring durable interconnects.

Replacement Considerations

Direct substitutes must match the 46-position dual-row layout, 3.96 mm pitch, and vertical panel mount form factor. Verify that alternative parts support the same 1.57 mm board thickness and offer equivalent gold-plated contact materials. Check for identical insulation material properties and operating temperature ranges to ensure functional interchangeability without redesign.